Daily Papers

Printed circuit board (PCB) schematic design defines nearly all electronic hardware, but it remains manual and expertise-intensive. While generative AI has advanced digital and analog IC design, PCB schematic generation from natural-language intent is largely unexplored. This paper presents SchGen, the first large language model that generates editable PCB schematics from natural-language requests. The key challenge lies in the lack of an LLM-suited representation and a large-scale dataset. Current schematic formats are dominated by verbose, tool-specific syntax and geometry-heavy descriptions, making them difficult to generate reliably. We introduce a semantically grounded code representation that encodes schematic editing primitives with relative placement and pin-name-based wiring, transforming a geometry-driven generation problem into a semantics-driven matching task amenable to LLMs. We further construct a large-scale dataset of PCB schematics paired with user prompts via a human-agent collaborative pipeline that converts open-source hardware designs into our representation. Experiments show that SchGen significantly outperforms alternative representations and even larger general-purpose LLMs on wire connectivity accuracy and functional correctness. Our results highlight the critical role of representation design in enabling generative models for complex hardware design tasks.

Printed Circuit Board (PCB) schematic design plays an essential role in all areas of electronic industries. Unlike prior works that focus on digital or analog circuits alone, PCB design must handle heterogeneous digital, analog, and power signals while adhering to real-world IC packages and pin constraints. Automated PCB schematic design remains unexplored due to the scarcity of open-source data and the absence of simulation-based verification. We introduce PCBSchemaGen, the first training-free framework for PCB schematic design that comprises LLM agent and Constraint-guided synthesis. Our approach makes three contributions: 1. an LLM-based code generation paradigm with iterative feedback with domain-specific prompts. 2. a verification framework leveraging a real-world IC datasheet derived Knowledge Graph (KG) and Subgraph Isomorphism encoding pin-role semantics and topological constraints. 3. an extensive experiment on 23 PCB schematic tasks spanning digital, analog, and power domains. Results demonstrate that PCBSchemaGen significantly improves design accuracy and computational efficiency.

Printed Circuit Boards are the foundation for the functioning of any electronic device, and therefore are an essential component for various industries such as automobile, communication, computation, etc. However, one of the challenges faced by the PCB manufacturers in the process of manufacturing of the PCBs is the faulty placement of its components including missing components. In the present scenario the infrastructure required to ensure adequate quality of the PCB requires a lot of time and effort. The authors present a novel solution for detecting missing components and classifying them in a resourceful manner. The presented algorithm focuses on pixel theory and object detection, which has been used in combination to optimize the results from the given dataset.

The usage of electronic devices increases, and becomes predominant in most aspects of life. Surface Mount Technology (SMT) is the most common industrial method for manufacturing electric devices in which electrical components are mounted directly onto the surface of a Printed Circuit Board (PCB). Although the expansion of electronic devices affects our lives in a productive way, failures or defects in the manufacturing procedure of those devices might also be counterproductive and even harmful in some cases. It is therefore desired and sometimes crucial to ensure zero-defect quality in electronic devices and their production. While traditional Image Processing (IP) techniques are not sufficient to produce a complete solution, other promising methods like Deep Learning (DL) might also be challenging for PCB inspection, mainly because such methods require big adequate datasets which are missing, not available or not updated in the rapidly growing field of PCBs. Thus, PCB inspection is conventionally performed manually by human experts. Unsupervised Learning (UL) methods may potentially be suitable for PCB inspection, having learning capabilities on the one hand, while not relying on large datasets on the other. In this paper, we introduce ChangeChip, an automated and integrated change detection system for defect detection in PCBs, from soldering defects to missing or misaligned electronic elements, based on Computer Vision (CV) and UL. We achieve good quality defect detection by applying an unsupervised change detection between images of a golden PCB (reference) and the inspected PCB under various setting. In this work, we also present CD-PCB, a synthesized labeled dataset of 20 pairs of PCB images for evaluation of defect detection algorithms.

Generating accurate circuit schematics from high-level natural language descriptions remains a persistent challenge in electronics design, as large language models (LLMs) frequently hallucinate in granular details, violate electrical constraints, and produce non-machine-readable outputs. We present CircuitLM, a novel multi-agent LLM-aided circuit design pipeline that translates user prompts into structured, visually interpretable CircuitJSON schematics through five sequential stages: (i) LLM-based component identification, (ii) canonical pinout retrieval, (iii) chain-of-thought reasoning by an electronics expert agent, (iv) JSON schematic synthesis, and (v) force-directed SVG visualization. Anchored by a curated, embedding-powered component knowledge base. While LLMs often violate electrical constraints, CircuitLM bridges this gap by grounding generation in a verified and dynamically extensible component database, initially comprising 50 components. To ensure safety, we incorporate a hybrid evaluation framework, namely Dual-Metric Circuit Validation (DMCV), validated against human-expert assessments, which achieves high fidelity in microcontroller-centric designs. We evaluate the system on 100 diverse embedded-systems prompts across six LLMs and introduce DMCV to assess both structural and electrical validity. This work bridges natural language input to deployable hardware designs, enabling reliable circuit prototyping by non-experts. Our code and data will be made public upon acceptance.

Packaging has become a crucial process due to the paradigm shift of More than Moore. Addressing manufacturing and yield issues is a significant challenge for modern layout algorithms. We propose to use printed circuit board (PCB) placement as a benchmark for the packaging problem. A maximum-margin formulation is devised to improve the separation between nets. Our framework includes seed layout proposals, a coordinate descent-based procedure to optimize routability, and a mixed-integer linear programming method to legalize the layout. We perform an extensive study with 14 PCB designs and an open-source router. We show that the placements produced by NS-place improve routed wirelength by up to 25\%, reduce the number of vias by up to 50\%, and reduce the number of DRVs by 79\% compared to manual and wirelength-minimal placements.

In recent years, Printed Circuit Boards (PCB) have become the backbone of a large number of consumer electronic devices leading to a surge in their production. This has made it imperative to employ automatic inspection systems to identify manufacturing defects in PCB before they are installed in the respective systems. An important task in this regard is the classification of defects as either true or pseudo defects, which decides if the PCB is to be re-manufactured or not. This work proposes a novel approach to detect most common defects in the PCBs. The problem has been approached by employing highly discriminative features based on multi-scale wavelet transform, which are further boosted by using a kernalized version of the support vector machines (SVM). A real world printed circuit board dataset has been used for quantitative analysis. Experimental results demonstrated the efficacy of the proposed method.

There can be numerous electronic components on a given PCB, making the task of visual inspection to detect defects very time-consuming and prone to error, especially at scale. There has thus been significant interest in automatic PCB component detection, particularly leveraging deep learning. However, deep neural networks typically require high computational resources, possibly limiting their feasibility in real-world use cases in manufacturing, which often involve high-volume and high-throughput detection with constrained edge computing resource availability. As a result of an exploration of efficient deep neural network architectures for this use case, we introduce PCBDet, an attention condenser network design that provides state-of-the-art inference throughput while achieving superior PCB component detection performance compared to other state-of-the-art efficient architecture designs. Experimental results show that PCBDet can achieve up to 2times inference speed-up on an ARM Cortex A72 processor when compared to an EfficientNet-based design while achieving sim2-4\% higher mAP on the FICS-PCB benchmark dataset.

To coupe with the difficulties in the process of inspection and classification of defects in Printed Circuit Board (PCB), other researchers have proposed many methods. However, few of them published their dataset before, which hindered the introduction and comparison of new methods. In this paper, we published a synthesized PCB dataset containing 1386 images with 6 kinds of defects for the use of detection, classification and registration tasks. Besides, we proposed a reference based method to inspect and trained an end-to-end convolutional neural network to classify the defects. Unlike conventional approaches that require pixel-by-pixel processing, our method firstly locate the defects and then classify them by neural networks, which shows superior performance on our dataset.

Printed Circuit Board (PCB) assurance in the optical domain is a crucial field of study. Though there are many existing PCB assurance methods using image processing, computer vision (CV), and machine learning (ML), the PCB field is complex and increasingly evolving so new techniques are required to overcome the emerging problems. Existing ML-based methods outperform traditional CV methods, however they often require more data, have low explainability, and can be difficult to adapt when a new technology arises. To overcome these challenges, CV methods can be used in tandem with ML methods. In particular, human-interpretable CV algorithms such as those that extract color, shape, and texture features increase PCB assurance explainability. This allows for incorporation of prior knowledge, which effectively reduce the number of trainable ML parameters and thus, the amount of data needed to achieve high accuracy when training or retraining an ML model. Hence, this study explores the benefits and limitations of a variety of common computer vision-based features for the task of PCB component detection using semantic data. Results of this study indicate that color features demonstrate promising performance for PCB component detection. The purpose of this paper is to facilitate collaboration between the hardware assurance, computer vision, and machine learning communities.

Previous works for PCB defect detection based on image difference and image processing techniques have already achieved promising performance. However, they sometimes fall short because of the unaccounted defect patterns or over-sensitivity about some hyper-parameters. In this work, we design a deep model that accurately detects PCB defects from an input pair of a detect-free template and a defective tested image. A novel group pyramid pooling module is proposed to efficiently extract features of a large range of resolutions, which are merged by group to predict PCB defect of corresponding scales. To train the deep model, a dataset is established, namely DeepPCB, which contains 1,500 image pairs with annotations including positions of 6 common types of PCB defects. Experiment results validate the effectiveness and efficiency of the proposed model by achieving 98.6% mAP @ 62 FPS on DeepPCB dataset. This dataset is now available at: https://github.com/tangsanli5201/DeepPCB.

Automated detection of defects in Printed Circuit Board (PCB) manufacturing using Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) machines can help improve operational efficiency and significantly reduce the need for manual intervention. In this paper, using SPI-extracted features of 6 million pins, we demonstrate a data-centric approach to train Machine Learning (ML) models to detect PCB defects at three stages of PCB manufacturing. The 6 million PCB pins correspond to 2 million components that belong to 15,387 PCBs. Using a base extreme gradient boosting (XGBoost) ML model, we iterate on the data pre-processing step to improve detection performance. Combining pin-level SPI features using component and PCB IDs, we developed training instances also at the component and PCB level. This allows the ML model to capture any inter-pin, inter-component, or spatial effects that may not be apparent at the pin level. Models are trained at the pin, component, and PCB levels, and the detection results from the different models are combined to identify defective components.

Outsourced printed circuit board (PCB) fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on automated optical inspection (AOI) have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward machine learning (ML) solutions. These require significant amounts of labeled ground truth data, which is lacking in the publicly available PCB data space. We contribute the FICS PCB Image Collection (FPIC) dataset to address this need. Additionally, we outline new hardware security methodologies enabled by our data set.

Circuit link prediction, which identifies missing component connections from incomplete netlists, is crucial in analog circuit design automation. However, existing methods face three main challenges: 1) Insufficient use of topological patterns in circuit graphs reduces prediction accuracy; 2) Data scarcity due to the complexity of annotations hinders model generalization; 3) Limited adaptability to various netlist formats restricts model flexibility. We propose Graph Neural Networks Based Analog Circuit Link Prediction (GNN-ACLP), a graph neural networks (GNNs) based method featuring three innovations to tackle these challenges. First, we introduce the SEAL (learning from Subgraphs, Embeddings, and Attributes for Link prediction) framework and achieve port-level accuracy in circuit link prediction. Second, we propose Netlist Babel Fish, a netlist format conversion tool that leverages retrieval-augmented generation (RAG) with a large language model (LLM) to enhance the compatibility of netlist formats. Finally, we build a comprehensive dataset, SpiceNetlist, comprising 775 annotated circuits of 7 different types across 10 component classes. Experiments demonstrate accuracy improvements of 16.08% on SpiceNetlist, 11.38% on Image2Net, and 16.01% on Masala-CHAI compared to the baseline in intra-dataset evaluation, while maintaining accuracy from 92.05% to 99.07% in cross-dataset evaluation, demonstrating robust feature transfer capabilities. However, its linear computational complexity makes processing large-scale netlists challenging and requires future addressing.

Engineering design operates through hierarchical abstraction from system specifications to component implementations, requiring visual understanding coupled with mathematical reasoning at each level. While Multi-modal Large Language Models (MLLMs) excel at natural image tasks, their ability to extract mathematical models from technical diagrams remains unexplored. We present CircuitSense, a comprehensive benchmark evaluating circuit understanding across this hierarchy through 8,006+ problems spanning component-level schematics to system-level block diagrams. Our benchmark uniquely examines the complete engineering workflow: Perception, Analysis, and Design, with a particular emphasis on the critical but underexplored capability of deriving symbolic equations from visual inputs. We introduce a hierarchical synthetic generation pipeline consisting of a grid-based schematic generator and a block diagram generator with auto-derived symbolic equation labels. Comprehensive evaluation of six state-of-the-art MLLMs, including both closed-source and open-source models, reveals fundamental limitations in visual-to-mathematical reasoning. Closed-source models achieve over 85\% accuracy on perception tasks involving component recognition and topology identification, yet their performance on symbolic derivation and analytical reasoning falls below 19\%, exposing a critical gap between visual parsing and symbolic reasoning. Models with stronger symbolic reasoning capabilities consistently achieve higher design task accuracy, confirming the fundamental role of mathematical understanding in circuit synthesis and establishing symbolic reasoning as the key metric for engineering competence.

Automatic generation of device-level analog circuit topologies remains a fundamental challenge in analog design automation. Recent transformer-based approaches have shown promise, yet they often suffer from limited functional controllability, memorization of training data, and the generation of electrically invalid circuits. We propose AnalogToBi, a device-level analog circuit topology generation framework that addresses these limitations. AnalogToBi enables explicit functional control via a circuit type token and adopts a bipartite graph-based circuit representation that decouples positional ordering from functional semantics, encouraging structural reasoning over sequence memorization. In addition, grammar-guided decoding enforces electrical validity during generation, while apply device renaming-based data augmentation improves generalization by increasing sequence diversity without altering circuit functionality. Experimental results show that AnalogToBi achieves 97.8% validity and 92.1% novelty, resulting in 89.9% valid and novel circuits under conditional generation, without human expert involvement. We further present that generated circuits can be automatically translated into SPICE netlists, and SPICE simulations confirm that AnalogToBi discovers high-quality analog topologies that outperform prior methods. For code and supplementary materials, see https://github.com/Seungmin0825/AnalogToBi

This paper describes a method combining Bayesian optimization (BO) and a lamped-capacitance thermal circuit network model that is effective for speeding up the thermal design optimization of an electronic circuit board layout with transient heating chips. As electronic devices have become smaller and more complex, the importance of thermal design optimization to ensure heat dissipation performance has increased. However, such thermal design optimization is difficult because it is necessary to consider various trade-offs associated with packaging and transient temperature changes of heat-generating components. This study aims to improve the performance of thermal design optimization by artificial intelligence. BO using a Gaussian process was combined with the lamped-capacitance thermal circuit network model, and its performance was verified by case studies. As a result, BO successfully found the ideal circuit board layout as well as particle swarm optimization (PSO) and genetic algorithm (GA) could. The CPU time for BO was 1/5 and 1/4 of that for PSO and GA, respectively. In addition, BO found a non-intuitive optimal solution in approximately 7 minutes from 10 million layout patterns. It was estimated that this was 1/1000 of the CPU time required for analyzing all layout patterns.

Graph representation learning on Analog-Mixed Signal (AMS) circuits is crucial for various downstream tasks, e.g., parasitic estimation. However, the scarcity of design data, the unbalanced distribution of labels, and the inherent diversity of circuit implementations pose significant challenges to learning robust and transferable circuit representations. To address these limitations, we propose CircuitGCL, a novel graph contrastive learning framework that integrates representation scattering and label rebalancing to enhance transferability across heterogeneous circuit graphs. CircuitGCL employs a self-supervised strategy to learn topology-invariant node embeddings through hyperspherical representation scattering, eliminating dependency on large-scale data. Simultaneously, balanced mean squared error (BMSE) and balanced softmax cross-entropy (BSCE) losses are introduced to mitigate label distribution disparities between circuits, enabling robust and transferable parasitic estimation. Evaluated on parasitic capacitance estimation (edge-level task) and ground capacitance classification (node-level task) across TSMC 28nm AMS designs, CircuitGCL outperforms all state-of-the-art (SOTA) methods, with the R^2 improvement of 33.64% sim 44.20% for edge regression and F1-score gain of 0.9times sim 2.1times for node classification. Our code is available at https://github.com/ShenShan123/CircuitGCL.

Addressing the critical theme of recycling electronic waste (E-waste), this contribution is dedicated to developing advanced automated data processing pipelines as a basis for decision-making and process control. Aligning with the broader goals of the circular economy and the United Nations (UN) Sustainable Development Goals (SDG), our work leverages non-invasive analysis methods utilizing RGB and hyperspectral imaging data to provide both quantitative and qualitative insights into the E-waste stream composition for optimizing recycling efficiency. In this paper, we introduce 'PCB-Vision'; a pioneering RGB-hyperspectral printed circuit board (PCB) benchmark dataset, comprising 53 RGB images of high spatial resolution paired with their corresponding high spectral resolution hyperspectral data cubes in the visible and near-infrared (VNIR) range. Grounded in open science principles, our dataset provides a comprehensive resource for researchers through high-quality ground truths, focusing on three primary PCB components: integrated circuits (IC), capacitors, and connectors. We provide extensive statistical investigations on the proposed dataset together with the performance of several state-of-the-art (SOTA) models, including U-Net, Attention U-Net, Residual U-Net, LinkNet, and DeepLabv3+. By openly sharing this multi-scene benchmark dataset along with the baseline codes, we hope to foster transparent, traceable, and comparable developments of advanced data processing across various scientific communities, including, but not limited to, computer vision and remote sensing. Emphasizing our commitment to supporting a collaborative and inclusive scientific community, all materials, including code, data, ground truth, and masks, will be accessible at https://github.com/hifexplo/PCBVision.

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm. The high dimension of X-ray images and the varying sizes of image dimensions also challenge the inspection algorithms. On the other hand, recent advances on deep learning shed light on image-based tasks and are competitive to human levels. In this paper, deep learning is incorporated in X-ray imaging based quality control during PCB quality inspection. Two artificial intelligence (AI) based models are proposed and compared for joint defect detection. The noised ROI problem and the varying sizes of imaging dimension problem are addressed. The efficacy of the proposed methods are verified through experimenting on a real-world 3D X-ray dataset. By incorporating the proposed methods, specialist inspection workload is largely saved.

We present an open-source database of superconducting quantum device designs that may be used as the starting point for customized devices. Each design can be generated programmatically using the open-source Qiskit Metal package, and simulated using finite-element electromagnetic solvers. We present a robust workflow for achieving high accuracy on design simulations. Many designs in the database are experimentally validated, showing excellent agreement between simulated and measured parameters. Our database includes a front-end interface that allows users to generate ``best-guess'' designs based on desired circuit parameters. This project lowers the barrier to entry for research groups seeking to make a new class of devices by providing them a well-characterized starting point from which to refine their designs.

Current multimodal large language models (MLLMs) struggle to understand circuit schematics due to their limited recognition capabilities. This could be attributed to the lack of high-quality schematic-netlist training data. Existing work such as AMSnet applies schematic parsing to generate netlists. However, these methods rely on hard-coded heuristics and are difficult to apply to complex or noisy schematics in this paper. We therefore propose a novel net detection mechanism based on segmentation with high robustness. The proposed method also recovers positional information, allowing digital reconstruction of schematics. We then expand AMSnet dataset with schematic images from various sources and create AMSnet 2.0. AMSnet 2.0 contains 2,686 circuits with schematic images, Spectre-formatted netlists, OpenAccess digital schematics, and positional information for circuit components and nets, whereas AMSnet only includes 792 circuits with SPICE netlists but no digital schematics.

The massive and large-scale design of foundational semiconductor integrated circuits (ICs) is crucial to sustaining the advancement of many emerging and future technologies, such as generative AI, 5G/6G, and quantum computing. Excitingly, recent studies have shown the great capabilities of foundational models in expediting the design of digital ICs. Yet, applying generative AI techniques to accelerate the design of analog ICs remains a significant challenge due to critical domain-specific issues, such as the lack of a comprehensive dataset and effective representation methods for analog circuits. This paper proposes, AnalogGenie, a textbf{Gen}erattextbf{i}ve textbf{e}ngine for automatic design/discovery of textbf{Analog} circuit topologies--the most challenging and creative task in the conventional manual design flow of analog ICs. AnalogGenie addresses two key gaps in the field: building a foundational comprehensive dataset of analog circuit topology and developing a scalable sequence-based graph representation universal to analog circuits. Experimental results show the remarkable generation performance of AnalogGenie in broadening the variety of analog ICs, increasing the number of devices within a single design, and discovering unseen circuit topologies far beyond any prior arts. Our work paves the way to transform the longstanding time-consuming manual design flow of analog ICs to an automatic and massive manner powered by generative AI. Our source code is available at https://github.com/xz-group/AnalogGenie.

Superconductor electronics (SCE) is a promising complementary and beyond CMOS technology. However, despite its practical benefits, the realization of SCE logic faces a significant challenge due to the absence of dense and scalable nonvolatile memory designs. While various nonvolatile memory technologies, including Non-destructive readout, vortex transitional memory (VTM), and magnetic memory, have been explored, achieving a superconductor random-access memory (RAM) crossbar array remains challenging. This paper introduces a novel, nonvolatile, high-density, and scalable VTM cell design for SCE applications. Our proposed design addresses scaling issues while boasting zero static power consumption characteristics. Our design leverages current summation, enabling analog multiply-accumulate operations -an essential feature for many in-memory computational tasks. We demonstrate the efficacy of our approach with a 32 x 32 superconductor memory array operating at 20 GHz. This design effectively addresses scaling issues and utilizes current summation that can be used for analog multiply-accumulate operations. Additionally, we showcase the accumulation property of the memory through analog simulations conducted on an 8 x 8 superconductor crossbar array.

The superconducting materials that make up an MKID have a significant effect on its performance. The T_c and normal state resistivity ρ_N of the film determine the penetration depth λ and therefore how much kinetic inductance it has. The ratio of kinetic inductance to total inductance (α), the volume of the inductor, and Q_m determines the magnitude of the response to incoming energy. The quasiparticle lifetime τ_qp is the characteristic time during which the MKID's surface impedance is modified by the incoming energy. Many materials have been explored for use in superconducting resonators and MKIDs, but that information is often not published or scattered around the literature. This chapter contains information and references on the work that has been done with thin film lithographed circuits for MKIDs over the last two decades. Note that measured material properties such as the internal loss quality factor Q_i and quasiparticle lifetime τ_qp vary significantly depending on how the MKID superconducting thin film is made and the system they are measured in, so it is best to interpret all stated values as typical but not definitive. Values are omitted in cases when there aren't enough measurements or there is too much disagreement in the literature to estimate a typical value. In order to be as complete as possible some unpublished results from the author's lab are included and can be identified by the lack of a reference. Unless noted all films are polycrystalline or amorphous.

In electronic design, engineers often manually search through extensive documents to retrieve component parameters required for constructing SPICE models, a process that is both labor-intensive and time-consuming. To address this challenge, we present an automated framework called D2S-FLOW that leverages large language models (LLMs) to extract electrical parameters from datasheets and generate SPICE models with high precision and efficiency, significantly reducing the need for manual intervention. Unlike traditional RAG systems, D2S-FLOW employs a workflow to enhance precision in handling unstructured documents and inconsistent naming conventions through three innovative mechanisms: Attention-Guided Document Focusing (AGDF), Hierarchical Document-Enhanced Retrieval (HDER), and Heterogeneous Named Entity Normalization (HNEN). AGDF narrows retrieval to user-selected documents, HDER utilizes document structure for precise parameter localization, and HNEN standardizes terminology via semantic inference. Experimental results demonstrate that the framework achieves an Exact Match (EM) of 0.86, an F1 score of 0.92, and an Exact Correctness (EC) of 0.96, outperforming the strongest baseline by 19.4%, 5.7%, and 13.1%, respectively. Additionally, it reduces API token consumption by 38% and minimizes the irrelevant information ratio to 4%, showcasing substantial improvements in resource efficiency. This research provides an effective automated solution for circuit design.

Perovskite solar cells (PSCs) have rapidly emerged as a leading contender in next-generation photovoltaic technologies, owing to their exceptional power conversion efficiencies and advantageous material properties. Despite these advances, challenges such as long-term stability, environmental sustainability, and scalable manufacturing continue to hinder their commercialization. Precursor additive engineering has shown promise in addressing these issues by enhancing both the performance and durability of PSCs. However, the explosive growth of scientific literature and the complex interplay of materials, processes, and device architectures make it increasingly difficult for researchers to efficiently access, organize, and utilize domain knowledge in this rapidly evolving field. To address this gap, we introduce Perovskite-R1, a specialized large language model (LLM) with advanced reasoning capabilities tailored for the discovery and design of PSC precursor additives. By systematically mining and curating 1,232 high-quality scientific publications and integrating a comprehensive library of 33,269 candidate materials, we constructed a domain-specific instruction-tuning dataset using automated question-answer generation and chain-of-thought reasoning. Fine-tuning the QwQ-32B model on this dataset resulted in Perovskite-R1, which can intelligently synthesize literature insights and generate innovative and practical solutions for defect passivation and the selection of precursor additives. Experimental validation of several model-proposed strategies confirms their effectiveness in improving material stability and performance. Our work demonstrates the potential of domain-adapted LLMs in accelerating materials discovery and provides a closed-loop framework for intelligent, data-driven advancements in perovskite photovoltaic research.

Design Conductor (DC) is an autonomous agent which applies the capabilities of frontier models to build semiconductors end-to-end -- that is, from concept to verified, tape-out ready GDSII (layout CAD file). In 12 hours and fully autonomously, DC was able to build several micro-architecture variations of a complete RISC-V CPU (which we dub VerCore) that meet timing at 1.48 GHz (rv32i-zmmul; using the ASAP7 PDK), starting from a 219-word requirements document. The VerCore achieves a CoreMark score of 3261. For historical context, this is roughly equivalent to an Intel Celeron SU2300 from mid-2011 (which ran at 1.2 GHz). To our knowledge, this is the first time an autonomous agent has built a complete, working CPU from spec to GDSII. This report is organized as follows. We first review DC's design and its key components. We then describe the methodology that DC followed to build VerCore -- including RTL implementation, testbench implementation, frontend debugging, optimization to achieve timing closure, and interacting with backend tools. We review the key characteristics of the resulting VerCore. Finally, we highlight how frontier models could improve to better enable this application, and our lessons learned as to how chips will be built in the future enabled by the capabilities of systems like DC.

In recent years, AI-assisted IC design methods have demonstrated great potential, but the availability of circuit design data is extremely limited, especially in the public domain. The lack of circuit data has become the primary bottleneck in developing AI-assisted IC design methods. In this work, we make the first attempt, SynCircuit, to generate new synthetic circuits with valid functionalities in the HDL format. SynCircuit automatically generates synthetic data using a framework with three innovative steps: 1) We propose a customized diffusion-based generative model to resolve the Directed Cyclic Graph (DCG) generation task, which has not been well explored in the AI community. 2) To ensure our circuit is valid, we enforce the circuit constraints by refining the initial graph generation outputs. 3) The Monte Carlo tree search (MCTS) method further optimizes the logic redundancy in the generated graph. Experimental results demonstrate that our proposed SynCircuit can generate more realistic synthetic circuits and enhance ML model performance in downstream circuit design tasks.

Two critical limitations of organic-inorganic lead halide perovskite materials for solar cells are their poor stability in humid environments and inclusion of toxic lead. In this study, high-throughput density functional theory (DFT) methods are used to computationally model and screen 1845 halide perovskites in search of new materials without these limitations that are promising for solar cell applications. This study focuses on finding materials that are comprised of nontoxic elements, stable in a humid operating environment, and have an optimal bandgap for one of single junction, tandem Si-perovskite, or quantum dot-based solar cells. Single junction materials are also screened on predicted single junction photovoltaic (PV) efficiencies exceeding 22.7%, which is the current highest reported PV efficiency for halide perovskites. Generally, these methods qualitatively reproduce the properties of known promising nontoxic halide perovskites that have either been experimentally evaluated or predicted from theory. From a set of 1845 materials, 15 materials pass all screening criteria for single junction cell applications, 13 of which have not been previously investigated, such as (CH3NH3)0.75Cs0.25SnI3, ((NH2)2CH)Ag0.5Sb0.5Br3, CsMn0.875Fe0.125I3, ((CH3)2NH2)Ag0.5Bi0.5I3, and ((NH2)2CH)0.5Rb0.5SnI3. These materials, together with others predicted in this study, may be promising candidate materials for stable, highly efficient, and non-toxic perovskite-based solar cells.

The electronic design automation of analog circuits has been a longstanding challenge in the integrated circuit field due to the huge design space and complex design trade-offs among circuit specifications. In the past decades, intensive research efforts have mostly been paid to automate the transistor sizing with a given circuit topology. By recognizing the graph nature of circuits, this paper presents a Circuit Graph Neural Network (CktGNN) that simultaneously automates the circuit topology generation and device sizing based on the encoder-dependent optimization subroutines. Particularly, CktGNN encodes circuit graphs using a two-level GNN framework (of nested GNN) where circuits are represented as combinations of subgraphs in a known subgraph basis. In this way, it significantly improves design efficiency by reducing the number of subgraphs to perform message passing. Nonetheless, another critical roadblock to advancing learning-assisted circuit design automation is a lack of public benchmarks to perform canonical assessment and reproducible research. To tackle the challenge, we introduce Open Circuit Benchmark (OCB), an open-sourced dataset that contains 10K distinct operational amplifiers with carefully-extracted circuit specifications. OCB is also equipped with communicative circuit generation and evaluation capabilities such that it can help to generalize CktGNN to design various analog circuits by producing corresponding datasets. Experiments on OCB show the extraordinary advantages of CktGNN through representation-based optimization frameworks over other recent powerful GNN baselines and human experts' manual designs. Our work paves the way toward a learning-based open-sourced design automation for analog circuits. Our source code is available at https://github.com/zehao-dong/CktGNN.

Innovative Electronic Design Automation (EDA) solutions are important to meet the design requirements for increasingly complex electronic devices. Verilog, a hardware description language, is widely used for the design and verification of digital circuits and is synthesized using specific EDA tools. However, writing code is a repetitive and time-intensive task. This paper proposes, primarily, a novel deep learning framework for training a Verilog autocompletion model and, secondarily, a Verilog dataset of files and snippets obtained from open-source repositories. The framework involves integrating models pretrained on general programming language data and finetuning them on a dataset curated to be similar to a target downstream task. This is validated by comparing different pretrained models trained on different subsets of the proposed Verilog dataset using multiple evaluation metrics. These experiments demonstrate that the proposed framework achieves better BLEU, ROUGE-L, and chrF scores by 9.5%, 6.7%, and 6.9%, respectively, compared to a model trained from scratch. Code and data are made available at: https://github.com/99EnriqueD/verilog_autocompletion .

IR drop analysis is essential in physical chip design to ensure the power integrity of on-chip power delivery networks. Traditional Electronic Design Automation (EDA) tools have become slow and expensive as transistor density scales. Recent works have introduced machine learning (ML)-based methods that formulate IR drop analysis as an image prediction problem. These existing ML approaches fail to capture both local and long-range dependencies and ignore crucial geometrical and topological information from physical layouts and logical connectivity. To address these limitations, we propose GIF, a Generative IR drop Framework that uses both geometrical and topological information to generate IR drop images. GIF fuses image and graph features to guide a conditional diffusion process, producing high-quality IR drop images. For instance, On the CircuitNet-N28 dataset, GIF achieves 0.78 SSIM, 0.95 Pearson correlation, 21.77 PSNR, and 0.026 NMAE, outperforming prior methods. These results demonstrate that our framework, using diffusion based multimodal conditioning, reliably generates high quality IR drop images. This shows that IR drop analysis can effectively leverage recent advances in generative modeling when geometric layout features and logical circuit topology are jointly modeled. By combining geometry aware spatial features with logical graph representations, GIF enables IR drop analysis to benefit from recent advances in generative modeling for structured image generation.

Printed Electronics (PE) feature distinct and remarkable characteristics that make them a prominent technology for achieving true ubiquitous computing. This is particularly relevant in application domains that require conformal and ultra-low cost solutions, which have experienced limited penetration of computing until now. Unlike silicon-based technologies, PE offer unparalleled features such as non-recurring engineering costs, ultra-low manufacturing cost, and on-demand fabrication of conformal, flexible, non-toxic, and stretchable hardware. However, PE face certain limitations due to their large feature sizes, that impede the realization of complex circuits, such as machine learning classifiers. In this work, we address these limitations by leveraging the principles of Approximate Computing and Bespoke (fully-customized) design. We propose an automated framework for designing ultra-low power Multilayer Perceptron (MLP) classifiers which employs, for the first time, a holistic approach to approximate all functions of the MLP's neurons: multiplication, accumulation, and activation. Through comprehensive evaluation across various MLPs of varying size, our framework demonstrates the ability to enable battery-powered operation of even the most intricate MLP architecture examined, significantly surpassing the current state of the art.

Understanding the structure and function of circuits is crucial for electronic design automation (EDA). Circuits can be formulated as And-Inverter graphs (AIGs), enabling efficient implementation of representation learning through graph neural networks (GNNs). Masked modeling paradigms have been proven effective in graph representation learning. However, masking augmentation to original circuits will destroy their logical equivalence, which is unsuitable for circuit representation learning. Moreover, existing masked modeling paradigms often prioritize structural information at the expense of abstract information such as circuit function. To address these limitations, we introduce MGVGA, a novel constrained masked modeling paradigm incorporating masked gate modeling (MGM) and Verilog-AIG alignment (VGA). Specifically, MGM preserves logical equivalence by masking gates in the latent space rather than in the original circuits, subsequently reconstructing the attributes of these masked gates. Meanwhile, large language models (LLMs) have demonstrated an excellent understanding of the Verilog code functionality. Building upon this capability, VGA performs masking operations on original circuits and reconstructs masked gates under the constraints of equivalent Verilog codes, enabling GNNs to learn circuit functions from LLMs. We evaluate MGVGA on various logic synthesis tasks for EDA and show the superior performance of MGVGA compared to previous state-of-the-art methods. Our code is available at https://github.com/wuhy68/MGVGA.

Recent advances in large language models have demonstrated their potential for automated generation of hardware description language (HDL) code from high-level prompts. Researchers have utilized fine-tuning to enhance the ability of these large language models (LLMs) in the field of Chip Design. However, the lack of Verilog data hinders further improvement in the quality of Verilog generation by LLMs. Additionally, the absence of a Verilog and Electronic Design Automation (EDA) script data augmentation framework significantly increases the time required to prepare the training dataset for LLM trainers. This paper proposes an automated design-data augmentation framework, which generates high-volume and high-quality natural language aligned with Verilog and EDA scripts. For Verilog generation, it translates Verilog files to an abstract syntax tree and then maps nodes to natural language with a predefined template. For Verilog repair, it uses predefined rules to generate the wrong verilog file and then pairs EDA Tool feedback with the right and wrong verilog file. For EDA Script generation, it uses existing LLM(GPT-3.5) to obtain the description of the Script. To evaluate the effectiveness of our data augmentation method, we finetune Llama2-13B and Llama2-7B models using the dataset generated by our augmentation framework. The results demonstrate a significant improvement in the Verilog generation tasks with LLMs. Moreover, the accuracy of Verilog generation surpasses that of the current state-of-the-art open-source Verilog generation model, increasing from 58.8% to 70.6% with the same benchmark. Our 13B model (ChipGPT-FT) has a pass rate improvement compared with GPT-3.5 in Verilog generation and outperforms in EDA script (i.e., SiliconCompiler) generation with only 200 EDA script data.

In today's rapidly evolving field of electronic design automation (EDA), the complexity of hardware designs is increasing, necessitating more sophisticated automation solutions. High-level synthesis (HLS), as a pivotal solution, automates hardware designs from high-level abstractions (e.g., C/C++). However, it faces significant challenges, particularly in design space exploration and optimization. While large language models (LLMs) have shown notable capabilities in code generation, their application to HLS has been limited due to the scarcity of (publicly) available HLS code datasets. Hence, research in this domain has primarily focused on techniques such as prompt engineering and retrieval-augmented generation (RAG). To overcome this limitation, this paper introduces SAGE-HLS, the first-of-its-kind fine-tuned LLM specifically for HLS code generation. Our method includes three key advancements: (i) We implement Verilog-to-C/C++ porting, converting verified and synthesizable Verilog codes into corresponding C, creating a dataset of 16.7K HLS codes; (ii) We implement a fine-tuning strategy, which is based on instruction prompting to code generation guided by abstract syntax tree (AST); (iii) We develop a semi-automated evaluation framework using VerilogEval to assess the functionality of the generated HLS code. Our experiments show that SAGE-HLS, fined-tuned on the QwenCoder (2.5) 7B model, achieves a near 100% success rate in code synthesizability and a 75% success rate in functional correctness.

Masala-CHAI is a fully automated framework leveraging large language models (LLMs) to generate Simulation Programs with Integrated Circuit Emphasis (SPICE) netlists. It addresses a long-standing challenge in circuit design automation: automating netlist generation for analog circuits. Automating this workflow could accelerate the creation of fine-tuned LLMs for analog circuit design and verification. In this work, we identify key challenges in automated netlist generation and evaluate multimodal capabilities of state-of-the-art LLMs, particularly GPT-4, in addressing them. We propose a three-step workflow to overcome existing limitations: labeling analog circuits, prompt tuning, and netlist verification. This approach enables end-to-end SPICE netlist generation from circuit schematic images, tackling the persistent challenge of accurate netlist generation. We utilize Masala-CHAI to collect a corpus of 7,500 schematics that span varying complexities in 10 textbooks and benchmark various open source and proprietary LLMs. Models fine-tuned on Masala-CHAI when used in LLM-agentic frameworks such as AnalogCoder achieve a notable 46% improvement in Pass@1 scores. We open-source our dataset and code for community-driven development.