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Subsea Compute Open Engineering Artifacts
Open engineering artifacts for a concept-level subsea compute prototype.
This dataset mirrors thermal screens, simulation outputs, CAD review packs, generated technical review packages, and reproduction scripts from the GitHub repository:
https://github.com/monish705/datacenter
These artifacts are public review materials. They are not certified fabrication drawings, pressure-vessel certification, deployment approvals, or commercial datacenter specifications.
What is included
- Blackwell/B200-class pod thermal screen
- V0 3xH100 liquid-loop and pump-failure simulation outputs
- energy/PUE seawater-temperature screens
- V0 and V1 technical review PDFs
- V1 900 mm OD / 2800 mm shell GA, B200 fit math, and cooling metrics
- concept CAD review packs and generated STEP/STL/DXF/PDF artifacts
- scripts and reusable simulation packages
Recommended entry points
- OPEN_SOURCE_BUILD_INDEX.md
echnical_review_package_v1/Subsea_Compute_V1_Technical_Review_Package.pdf- esults/blackwell_pod_thermal_screen_2026-05-12/blackwell_pod_thermal_screen.md
- esults/prototype_v0_3h100/simulation_report.md
Limits
The models are screening tools. Qualified engineering review is required before fabrication, deployment, lifting, pressure testing, electrical operation, or water exposure.
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